This position is for a thermal/mechanical Engineering Intern in Assembly and Test Technology Development organization at Intel Corporation.
We are looking for an outstanding candidate to join Thermal Mechanical Definition and Development team which is responsible for defining and building Intel's future test solutions to enable new products and meet high volume manufacturing needs.
This is a diverse team of engineers who engage in defining, developing, validating, qualifying and deploying test platforms, capabilities and modules across the full spectrum of test operations.
In this position, the candidate will engage in assessing thermal/mechanical risks for new packaging technologies as well as designing and characterizing thermal performance of new hardware for testing semiconductor packages.
The work can include thermal simulation using commercial software and in-house tools, in addition to hands-on testing and characterization in the lab. In this role, the candidate will collaborate closely with other team members as well as other technology development teams.
The intern should also exhibit the following behavioral traits or/and skills:
- Self-motivated with ability to work independently
- Creative problem solving, writing and verbal communication skills with the ability to work in a dynamic team environment with troubleshooting skills
This is an internship and compensation will be given accordingly based on candidate education level and internship duration.
You must possess the below minimum qualifications to be initially considered for this position.
Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Knowledge and/or experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences
- Pursuing a master's degree or PhD degree in Mechanical engineering or related fields
- Fundamental understanding of thermals and heat transfer
- Hands-on experimentation and experience with temperature, flow, and pressure measurement tools
- Experience with thermal modeling tools as well as mechanical design tools
- Knowledge of experimental design and statistical analysis
- Knowledge of assembly/packaging, electronics cooling, and automatic controls
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....