Intern - Packaging (Assembly & Test)

NXP Semiconductors

Quality Assurance Internship

NXP Semiconductors enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, we are driving innovation in the secure connected vehicle, end-to-end security & privacy and smart connected solutions markets.

Industry 4.0 Big Data analytics development for assembly & test to identify critical process interactions (including wafer and assembly) for improved quality and assembly yield.

Data scientist position will include focus on small signal analysis and new data analytics methods for line control monitoring.

Intern position will focus on semiconductor package assembly process control to enable improved quality and yield performance. Data analytics (Big Data) analysis of multiple data sources will be used to establish improved monitoring strategy. Position may include wirebond predictive modeling and process control strategy.

Candidate with basic knowledge of semiconductor wafer /assembly processing is preferred.

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.